Single Crystal CVD Diamond Microchannel Heat Sink
Single crystal CVD diamond microchannel heat sinks for liquid-cooled thermal management of high-power semiconductor and photonic devices.
The combination of diamond heat spreading and microchannel convection enables efficient heat removal close to the active junction, making this structure suitable for applications where conventional heat spreaders are insufficient.
Custom microchannel geometries, metallization designs and mounting surfaces are available according to thermal and packaging requirements.
Specifications
| Item | Description |
|---|---|
| Material | Single Crystal CVD Diamond |
| Structure | Diamond Substrate with Microchannels |
| Cooling Method | Liquid Cooling |
| Surface Option | Bare Diamond or Metallized Surface |
| Shape | Square, Rectangular or Custom |
| Thickness | Custom |
| Channel Design | Custom Width, Depth, Pitch and Flow Path |
| Surface Finish | Lapped, Polished or Custom |
| Integration | Die Attach, Submount, Thermal Substrate |
Typical Applications
Single crystal diamond microchannel heat sinks are used in thermal management systems where heat is generated within a small active area and must be removed efficiently.
Common applications include GaN RF amplifiers, microwave devices, SiC power modules, laser diode assemblies, photonic components and advanced semiconductor packages.
Metallization Options
Metallized surfaces can be supplied for die attachment, soldering, wire bonding and package integration.
Metal stack design is selected according to the assembly process and application requirements.
Custom Manufacturing
The following parameters can be customized:
Channel geometry
Channel depth and pitch
Flow path design
Substrate dimensions
Diamond thickness
Surface finish
Metallization structure
Inlet and outlet configuration
Engineering review based on customer drawings is available.
Flat Diamond vs Microchannel Diamond
| Structure | Typical Function |
|---|---|
| Flat Diamond Heat Spreader | Passive heat spreading |
| Metallized Diamond Heat Spreader | Heat spreading with device mounting |
| Diamond Microchannel Heat Sink | Liquid-cooled thermal management |
| Metallized Diamond Microchannel | Cooling and package integration |
Ordering Information
Microchannel heat sinks are manufactured according to customer requirements.
For quotation, please provide substrate dimensions, channel design, coolant type, mounting method and target quantity. Thermal simulations, drawings and packaging information may be included if available.