Single Crystal CVD Diamond Heat Spreaders
Single crystal CVD diamond heat spreaders for high-power electronic, photonic and semiconductor applications.
With thermal conductivity typically ranging from 1800 to 2200 W/m·K, single crystal CVD diamond is widely used where conventional thermal management materials cannot provide sufficient heat spreading performance. The combination of ultra-high thermal conductivity and electrical insulation makes it suitable for RF devices, laser diodes, GaN electronics, SiC power modules and advanced semiconductor packaging.
Standard sizes from 3 × 3 mm to 20 × 20 mm are available. Custom dimensions, thicknesses, surface finishes and metallization options can be manufactured according to application requirements.
Specifications
| Item | Description |
|---|---|
| Material | Single Crystal CVD Diamond |
| Thermal Conductivity | 1800–2200 W/m·K |
| Standard Sizes | 3 × 3 mm to 20 × 20 mm |
| Shape | Square, Rectangular or Custom |
| Thickness | Custom |
| Surface Finish | Lapped, Polished or Custom |
| Metallization | Available Upon Request |
| Electrical Property | Electrically Insulating |
| Supply Mode | Standard Sizes or Custom Manufacturing |
Why Use Single Crystal CVD Diamond?
Heat generated by modern RF devices, laser diodes and power semiconductors is often concentrated within a very small active area. Single crystal CVD diamond offers thermal conductivity significantly higher than copper, aluminum nitride and most conventional substrate materials, helping reduce junction temperature and improve thermal reliability.
| Material | Typical Thermal Conductivity (W/m·K) |
|---|---|
| Copper | ~400 |
| Aluminum Nitride (AlN) | 170–220 |
| Polycrystalline CVD Diamond | 1200–2000 |
| Single Crystal CVD Diamond | 1800–2200 |
For compact devices with high power density, diamond heat spreaders are frequently used as thermal substrates, submounts or heat-spreading layers positioned directly beneath the heat source.
Typical Applications
Single crystal CVD diamond heat spreaders are commonly used in:
RF power amplifiers and microwave devices
GaN RF components
SiC power electronics
Laser diode submounts
High-power laser modules
Optoelectronic devices
Advanced semiconductor packaging
Research and prototype thermal platforms
Custom Manufacturing
Custom fabrication services are available for dimensions, thickness, polishing quality and metallization requirements.
Depending on the application, the diamond component may be supplied as a bare heat spreader, metallized thermal substrate or precision-finished submount ready for further assembly.
Inspection reports, dimensional measurements and product photographs can be provided before shipment.
Ordering Information
For quotation, please provide dimensions, thickness, surface finish requirements, metallization requirements and quantity.
For RF, laser or semiconductor applications, information such as mounting method, operating power level and package structure can help optimize material selection and manufacturing specifications.