Spherical HPHT diamond particles, produced by rounding primary HPHT diamond grains through a controlled spheroidization process. Sphericity reaches up to 0.98. Available in rough or smooth surface finish, covering mesh sizes from 14/16 to 400/500 — with coarser sizes on request.
Used in diamond tool formulations and thermal conductive filler systems. Supplied to specification via RFQ.
Product Specifications
| Parameter | Detail |
|---|---|
| Material | HPHT synthetic diamond |
| Starting material | Primary HPHT diamond grains |
| Process | Spheroidization / rounding |
| Sphericity | Up to 0.98 |
| Surface finish | Rough or smooth |
| Mesh size range | 14/16 to 400/500 mesh (coarser sizes available) |
| Flowability | High |
| Applications | Diamond tools, thermal conductive fillers, functional composites |
| Order type | RFQ / custom specification |
| Supply | Partner-manufactured, distributed by INFI Diamond Component |
Particle Size Options
| Category | Mesh Sizes |
|---|---|
| Coarse | 14/16, 16/18, 18/20, 20/25 (or larger) |
| Medium | 30/35, 40/45, 50/60, 60/70 |
| Fine | 80/100, 100/120, 120/140, 140/170 |
| Very fine | 200/230, 270/325, 325/400, 400/500 |
| Custom | Available by RFQ |
Surface Finish Options
| Finish | Characteristics | Typical Use |
|---|---|---|
| Rough surface | Textured surface; higher mechanical interlocking with bond matrix | Metal-bond, resin-bond, and vitrified-bond diamond tools |
| Smooth surface | Rounded surface; better flowability and packing density | Thermal interface materials, polymer/metal/ceramic matrix composites, high-loading filler systems |
Why Spherical Diamond Particles?
Irregular diamond grit packs unevenly and flows poorly in high-loading systems. Spherical geometry raises packing density, reduces void fraction, and gives consistent flow behavior — which matters in both thermal filler compounding and precision tool matrix formulation.
Rough-surface variants retain the mechanical grip needed for tool bond systems. Smooth-surface variants are the better choice where flowability and filler loading are the primary constraints.
Applications
- Metal-bond, resin-bond, and vitrified-bond diamond tools
- Thermal interface materials (TIM)
- Polymer matrix thermal composites
- Metal matrix composites (MMC)
- Ceramic matrix composites (CMC)
- High-loading diamond filler formulations
- Functional filler systems
- R&D applications requiring controlled particle geometry
Surface Type Selection
| Application requirement | Recommended finish |
|---|---|
| Matrix bonding strength | Rough surface |
| Mechanical interlocking with bond material | Rough surface |
| Diamond tool formulation | Rough surface |
| High flowability in compounding | Smooth surface |
| High filler loading (>50 vol%) | Smooth surface |
| Thermal conductive filler system | Smooth surface |
| Dense packing / low void fraction | Smooth surface |
| Non-standard requirement | Submit via RFQ for review |
Not sure which finish fits your system? Send us your matrix material, target particle size, and processing method — we'll advise before you order.
Request a Quote
All orders are processed by specification: particle size, sphericity grade, surface finish, and quantity. Contact Diamond Component with your requirements to receive pricing and lead time.