Free-Standing Thermal Grade Polycrystalline CVD Diamond Heat Spreaders

Free-Standing Thermal Grade Polycrystalline CVD Diamond Heat Spreaders

2 inch / 1000 W/m.k
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Free-Standing Thermal Grade Polycrystalline CVD Diamond Heat Spreaders
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Free-Standing Thermal Grade Polycrystalline CVD Diamond Heat Spreaders

$0.00
Sale price  $0.00 Regular price 
Size
Thermal conductity

Polycrystalline CVD Diamond Heat Spreader Plates

Free-standing polycrystalline CVD diamond heat spreader plates grown by microwave plasma CVD for thermal management and electronic packaging applications.

The material is available in thermal conductivity grades of 1000 W/m·K, 1500+ W/m·K and 1800+ W/m·K. Parent plates are produced in 2-inch and 4-inch formats and can be cut into custom dimensions for heat spreaders, submounts, thermal substrates and prototype components.

Thicknesses from 0.05 mm to 2.0 mm are available, with lapped or polished surface finishes depending on application requirements.

Specifications

Item Description
Material Polycrystalline CVD Diamond
Growth Method Microwave Plasma CVD
Structure Free-Standing Diamond Plate
Parent Plate Size 2-inch, 4-inch
Thickness Range 0.05–2.0 mm
Thermal Conductivity 1000, 1500+, 1800+ W/m·K
Surface Finish Lapped or Polished
Surface Roughness Up to Ra ≤ 30 nm
Shape Square, Rectangular, Round or Custom
Supply Mode Custom Manufacturing

Thermal Conductivity Grades

Grade Thermal Conductivity Typical Applications
Standard Thermal 1000 W/m·K General Heat Spreading, Thermal Evaluation
High Thermal 1500+ W/m·K Electronic Packaging, RF Devices, Laser Modules
Premium Thermal 1800+ W/m·K High-Power Electronics, Advanced Packaging, High Heat Flux Applications

Material appearance may vary from opaque to semi-transparent depending on grade and growth characteristics. For optical transmission applications, please refer to optical-grade CVD diamond products.

Why Polycrystalline CVD Diamond?

Polycrystalline CVD diamond offers significantly higher thermal conductivity than conventional thermal management materials used in electronic packaging.

Material Typical Thermal Conductivity (W/m·K)
Copper ~400
Aluminum Nitride (AlN) 170–220
Silicon Carbide (SiC) 120–490
Polycrystalline CVD Diamond 1000–1800+

This combination of high thermal conductivity, electrical insulation and dimensional stability makes CVD diamond suitable for applications where localized heat must be spread efficiently.

Typical Applications

Polycrystalline CVD diamond heat spreaders are widely used in laser diode submounts, RF power devices, microwave electronics, power semiconductor modules, high-power LED systems and advanced semiconductor packaging.

The material is also used for thermal test vehicles, research projects and prototype thermal management assemblies.

Custom Cutting and Processing

Free-standing diamond plates can be supplied as full parent plates or precision-cut components.

Available processing options include:

Custom dimensions

Round, square and irregular shapes

Thickness control

Precision polishing

Edge processing

Inspection reports

For thin plates, tight-tolerance components or packaging applications, flatness, roughness and dimensional requirements should be specified during inquiry.

Ordering Information

For quotation, please provide dimensions, thickness, thermal conductivity grade, quantity and surface finish requirements.

Drawings, tolerance requirements and application information can help determine the most suitable material grade and manufacturing process.

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