Ultra-Thin CVD Diamond Film on Carrier Tape
Ultra-thin polycrystalline CVD diamond film supplied on adhesive carrier tape for research, transfer processes, thermal material evaluation and microfabrication development.
The material is available in 2-inch and 4-inch wafer formats with typical film thicknesses between 8 μm and 15 μm. Depending on film quality and measurement method, thermal conductivity is typically estimated in the range of 800–1000 W/m·K.
The carrier tape provides temporary mechanical support during handling, transport and process development.
Specifications
| Item | Description |
|---|---|
| Material | Polycrystalline CVD Diamond Film |
| Format | 2-inch or 4-inch Wafer |
| Carrier | Adhesive Carrier Tape |
| Film Thickness | Typically 8–15 μm |
| Thermal Conductivity | Approx. 800–1000 W/m·K |
| Surface Finish | As-Grown |
| Surface Roughness | Not Specified |
| Cutting Service | Not Available in Current Format |
| Supply Mode | RFQ or Stock Confirmation |
Why Use Ultra-Thin Diamond Film?
Diamond combines high thermal conductivity, chemical stability and mechanical durability. When produced as an ultra-thin film, it becomes attractive for applications involving material transfer, thin-film integration, thermal spreading studies and advanced microfabrication processes.
The carrier-supported format allows handling of very thin diamond films that would otherwise be difficult to transport or process.
Typical Applications
Ultra-thin CVD diamond films are commonly used in:
Diamond membrane research
Thin-film transfer processes
Thermal material evaluation
Microfabrication process development
Heat spreading studies
Surface bonding experiments
Advanced substrate research
Prototype device development
Material Characteristics
| Property | Typical Value |
|---|---|
| Film Thickness | 8–15 μm |
| Thermal Conductivity | 800–1000 W/m·K |
| Structure | Polycrystalline Diamond |
| Support Format | Carrier Tape Mounted |
The term "flexible diamond film" refers to the carrier-supported thin-film format. The diamond layer itself remains a rigid ceramic material and should not be considered elastomeric or stretchable.
Handling Considerations
The carrier tape is intended for transport and temporary support only. Process compatibility, temperature limits and transfer procedures should be evaluated by the user before production use.
Care should be taken to avoid sharp folding, excessive bending or uncontrolled film removal. For transfer applications, a validated bonding and release process is recommended.
Custom Requirements
Please discuss the following requirements before ordering:
Film thickness
Wafer format
Quantity
Transfer process requirements
Thermal performance requirements
Surface characterization requirements
Special inspection requests
Ordering Information
Because process requirements vary significantly between applications, this material is supplied by RFQ.
When requesting a quotation, please provide wafer size, quantity, intended application and any transfer, bonding or thermal performance requirements.
Stock photographs, visual inspection records and thickness information can be supplied upon request.