Custom metallized polycrystalline CVD diamond heat spreaders for high-power LED thermal management, die bonding and electronic packaging applications. Available with copper, gold, silver and other custom metal coatings, cut to customer-defined shapes and sizes.
These metallized polycrystalline CVD diamond heat spreaders are designed for high-performance thermal management applications, especially high-power LED packages, LED modules, laser diodes, power devices and custom electronic packaging.
The base material is thermal grade polycrystalline CVD diamond, offering high thermal conductivity, electrical insulation and excellent heat spreading capability. Metal coatings can be applied to one or both sides of the diamond surface to support die bonding, soldering, brazing, wire bonding or integration into customer-specific package structures.
Available metallization options include copper, gold, silver and other custom metal stacks. Shape, size, thickness, metallization area and coating structure are customized according to customer drawings and assembly requirements.
This product is supplied as a custom metallized diamond heat spreader, not as a finished LED module or finished electronic package.
Product Specifications
| Item | Specification |
|---|---|
| Product | Metallized Polycrystalline CVD Diamond Heat Spreader |
| Base Material | Thermal grade polycrystalline CVD diamond |
| Growth Method | Microwave plasma CVD |
| Structure | Free-standing CVD diamond plate with metallization |
| Application | LED thermal management, die bonding, electronic packaging |
| Shape | Custom square, rectangular, round or special shape |
| Size | Custom according to drawing |
| Thickness | Custom, according to thermal and packaging requirement |
| Thermal Conductivity Grade | 1000 W/m·K / 1500+ W/m·K / 1800+ W/m·K |
| Surface Finish | Lapped / Polished (Ra ≤ 30 nm) |
| Metallization Options | Cu, Au, Ag and custom metal stacks |
| Metallization Side | Single-side / Double-side / Patterned |
| Bonding Compatibility | Soldering, brazing, die attach or customer-defined process |
| Order Type | Custom RFQ |
| Documentation | Dimensional inspection, surface information, metallization notes and actual photos available upon request |
Metallization Options
Metal coatings can be applied to the CVD diamond surface according to the customer's bonding method, package structure and thermal interface requirement.
- Copper metallization
- Gold metallization
- Silver metallization
- Nickel / Gold metallization
- Titanium / Platinum / Gold metallization
- Chromium / Gold metallization
- Custom adhesion layer + functional metal layer
- Single-side metallization
- Double-side metallization
- Full-area or patterned metallization
The final metallization stack should be selected according to the customer's bonding process, solder material, operating temperature, adhesion requirement and package design. For LED thermal applications, please provide the die attach method and assembly process before quotation.
Base Diamond Thermal Grades
1000 W/m·K Grade
Opaque thermal grade CVD diamond for cost-sensitive thermal spreading applications.
1500+ W/m·K Grade
Semi-transparent higher thermal grade CVD diamond for higher-performance heat spreading applications.
1800+ W/m·K Grade
Transparent premium thermal grade CVD diamond for demanding thermal management and advanced packaging applications.
The transparent appearance of higher thermal grades is used as a material grade description and should not be treated as an optical window specification.
LED Thermal Management Applications
Metallized CVD diamond heat spreaders are suitable for high-power LED packages and LED thermal modules where fast heat spreading, electrical insulation and compact package design are required.
The diamond heat spreader can be used as a thermal spreading layer between the LED chip and the package substrate, or as a customized submount component depending on the customer's design.
For LED applications, the metallized diamond component can be customized according to:
- LED chip size
- Heat source area
- Die attach method
- Solder or bonding material
- Package structure
- Required thermal path
- Electrical isolation requirement
- Batch production requirement
For mature LED heat spreader applications, batch production can be discussed based on confirmed drawing, metallization stack and acceptance criteria.
Shape & Size Customization
Metallized CVD diamond heat spreaders are made according to customer drawings or specifications. Available shape options include:
- Square heat spreaders
- Rectangular heat spreaders
- Round components
- LED submount shapes
- Chip-size heat spreaders
- Multi-chip heat spreaders
- Custom package-matched geometry
- Patterned metallization layouts
Please provide drawings, dimensions, thickness, metallization area and quantity for quotation.
Surface Finish Options
Lapped Surface
Suitable for standard thermal applications, further bonding preparation and cost-sensitive designs.
Polished Surface
Recommended when improved surface contact, lower roughness or more controlled bonding conditions are required. Polished roughness is available up to Ra ≤ 30 nm, depending on size, thickness and material grade.
Surface roughness, flatness and metallization adhesion requirements should be confirmed before production.
Product Features
- Thermal grade polycrystalline CVD diamond base material
- High thermal conductivity diamond heat spreading layer
- Electrical insulation from the diamond substrate
- Custom copper, gold, silver or other metal coatings
- Single-side or double-side metallization
- Full-area or patterned metallization available
- Custom shapes and sizes according to drawings
- Suitable for LED thermal management and die bonding applications
- Lapped or polished surface options
- Polished surface roughness up to Ra ≤ 30 nm
- Batch production available after specification confirmation
Recommended Applications
- High-power LED heat spreaders
- LED chip submounts
- LED module thermal substrates
- Laser diode submounts
- Power electronics heat spreaders
- RF device thermal management
- Semiconductor package heat spreaders
- Multi-chip package thermal spreading
- Custom metallized diamond substrates
- Research and prototype thermal packages
Final suitability depends on the customer's chip design, die attach process, metallization stack, bonding layer thickness and package thermal structure.
Custom RFQ Information
To prepare a quotation for metallized CVD diamond heat spreaders, please provide the following information:
- Application
- Required diamond shape and dimensions
- Thickness
- Thermal conductivity grade
- Surface finish: lapped or polished
- Metallization material: Cu / Au / Ag / other
- Metallization stack, if specified
- Single-side or double-side metallization
- Full-area or patterned metallization
- Quantity
- Drawing or package structure
Important Notes
This product is supplied as a custom metallized CVD diamond heat spreader or substrate. It is not supplied as a finished LED module, finished package or fully assembled electronic device unless otherwise agreed.
The metallization stack should be selected according to the customer's bonding process, solder material, die attach method, operating temperature and reliability requirements.
Thermal performance in the final application depends on the diamond material grade, component geometry, metallization structure, bonding layer thickness, thermal interface quality and overall package design.
For LED mass production applications, drawings, metallization stack, inspection criteria and acceptance requirements should be confirmed before batch production.