{"product_id":"custom-metallized-cvd-diamond-heat-spreaders","title":"Custom Metallized CVD Diamond Heat Spreaders","description":"\u003cp\u003eCustom metallized polycrystalline CVD diamond heat spreaders for high-power LED thermal management, die bonding and electronic packaging applications. Available with copper, gold, silver and other custom metal coatings, cut to customer-defined shapes and sizes.\u003c\/p\u003e\n\u003cp\u003eThese metallized polycrystalline CVD diamond heat spreaders are designed for high-performance thermal management applications, especially high-power LED packages, LED modules, laser diodes, power devices and custom electronic packaging.\u003c\/p\u003e\n\u003cp\u003eThe base material is thermal grade polycrystalline CVD diamond, offering high thermal conductivity, electrical insulation and excellent heat spreading capability. Metal coatings can be applied to one or both sides of the diamond surface to support die bonding, soldering, brazing, wire bonding or integration into customer-specific package structures.\u003c\/p\u003e\n\u003cp\u003eAvailable metallization options include copper, gold, silver and other custom metal stacks. Shape, size, thickness, metallization area and coating structure are customized according to customer drawings and assembly requirements.\u003c\/p\u003e\n\u003cp\u003e\u003cem\u003eThis product is supplied as a custom metallized diamond heat spreader, not as a finished LED module or finished electronic package.\u003c\/em\u003e\u003c\/p\u003e\n\u003chr\u003e\n\u003ch2\u003eProduct Specifications\u003c\/h2\u003e\n\u003ctable style=\"width: 100%; border-collapse: collapse;\" cellspacing=\"0\" border=\"0\"\u003e\n\u003cthead\u003e\n\u003ctr style=\"background-color: #f0f0f0;\"\u003e\n\u003cth style=\"padding: 8px 12px; text-align: left; width: 30%;\"\u003eItem\u003c\/th\u003e\n\u003cth style=\"padding: 8px 12px; text-align: left;\"\u003eSpecification\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003eProduct\u003c\/td\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003eMetallized Polycrystalline CVD Diamond Heat Spreader\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"background-color: #fafafa;\"\u003e\n\u003ctd style=\"padding: 8px 12px;\"\u003eBase Material\u003c\/td\u003e\n\u003ctd style=\"padding: 8px 12px;\"\u003eThermal grade polycrystalline CVD diamond\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003eGrowth Method\u003c\/td\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003eMicrowave plasma CVD\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"background-color: #fafafa;\"\u003e\n\u003ctd style=\"padding: 8px 12px;\"\u003eStructure\u003c\/td\u003e\n\u003ctd style=\"padding: 8px 12px;\"\u003eFree-standing CVD diamond plate with metallization\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003eApplication\u003c\/td\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003eLED thermal management, die bonding, electronic packaging\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"background-color: #fafafa;\"\u003e\n\u003ctd style=\"padding: 8px 12px;\"\u003eShape\u003c\/td\u003e\n\u003ctd style=\"padding: 8px 12px;\"\u003eCustom square, rectangular, round or special shape\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003eSize\u003c\/td\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003eCustom according to drawing\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"background-color: #fafafa;\"\u003e\n\u003ctd style=\"padding: 8px 12px;\"\u003eThickness\u003c\/td\u003e\n\u003ctd style=\"padding: 8px 12px;\"\u003eCustom, according to thermal and packaging requirement\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003eThermal Conductivity Grade\u003c\/td\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003e1000 W\/m·K \/ 1500+ W\/m·K \/ 1800+ W\/m·K\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"background-color: #fafafa;\"\u003e\n\u003ctd style=\"padding: 8px 12px;\"\u003eSurface Finish\u003c\/td\u003e\n\u003ctd style=\"padding: 8px 12px;\"\u003eLapped \/ Polished (Ra ≤ 30 nm)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003eMetallization Options\u003c\/td\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003eCu, Au, Ag and custom metal stacks\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"background-color: #fafafa;\"\u003e\n\u003ctd style=\"padding: 8px 12px;\"\u003eMetallization Side\u003c\/td\u003e\n\u003ctd style=\"padding: 8px 12px;\"\u003eSingle-side \/ Double-side \/ Patterned\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003eBonding Compatibility\u003c\/td\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003eSoldering, brazing, die attach or customer-defined process\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"background-color: #fafafa;\"\u003e\n\u003ctd style=\"padding: 8px 12px;\"\u003eOrder Type\u003c\/td\u003e\n\u003ctd style=\"padding: 8px 12px;\"\u003eCustom RFQ\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003eDocumentation\u003c\/td\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003eDimensional inspection, surface information, metallization notes and actual photos available upon request\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003chr\u003e\n\u003ch2\u003eMetallization Options\u003c\/h2\u003e\n\u003cp\u003eMetal coatings can be applied to the CVD diamond surface according to the customer's bonding method, package structure and thermal interface requirement.\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eCopper metallization\u003c\/li\u003e\n\u003cli\u003eGold metallization\u003c\/li\u003e\n\u003cli\u003eSilver metallization\u003c\/li\u003e\n\u003cli\u003eNickel \/ Gold metallization\u003c\/li\u003e\n\u003cli\u003eTitanium \/ Platinum \/ Gold metallization\u003c\/li\u003e\n\u003cli\u003eChromium \/ Gold metallization\u003c\/li\u003e\n\u003cli\u003eCustom adhesion layer + functional metal layer\u003c\/li\u003e\n\u003cli\u003eSingle-side metallization\u003c\/li\u003e\n\u003cli\u003eDouble-side metallization\u003c\/li\u003e\n\u003cli\u003eFull-area or patterned metallization\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003eThe final metallization stack should be selected according to the customer's bonding process, solder material, operating temperature, adhesion requirement and package design. For LED thermal applications, please provide the die attach method and assembly process before quotation.\u003c\/p\u003e\n\u003chr\u003e\n\u003ch2\u003eBase Diamond Thermal Grades\u003c\/h2\u003e\n\u003cp\u003e\u003cstrong\u003e1000 W\/m·K Grade\u003c\/strong\u003e\u003cbr\u003eOpaque thermal grade CVD diamond for cost-sensitive thermal spreading applications.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003e1500+ W\/m·K Grade\u003c\/strong\u003e\u003cbr\u003eSemi-transparent higher thermal grade CVD diamond for higher-performance heat spreading applications.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003e1800+ W\/m·K Grade\u003c\/strong\u003e\u003cbr\u003eTransparent premium thermal grade CVD diamond for demanding thermal management and advanced packaging applications.\u003c\/p\u003e\n\u003cp\u003e\u003cem\u003eThe transparent appearance of higher thermal grades is used as a material grade description and should not be treated as an optical window specification.\u003c\/em\u003e\u003c\/p\u003e\n\u003chr\u003e\n\u003ch2\u003eLED Thermal Management Applications\u003c\/h2\u003e\n\u003cp\u003eMetallized CVD diamond heat spreaders are suitable for high-power LED packages and LED thermal modules where fast heat spreading, electrical insulation and compact package design are required.\u003c\/p\u003e\n\u003cp\u003eThe diamond heat spreader can be used as a thermal spreading layer between the LED chip and the package substrate, or as a customized submount component depending on the customer's design.\u003c\/p\u003e\n\u003cp\u003eFor LED applications, the metallized diamond component can be customized according to:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eLED chip size\u003c\/li\u003e\n\u003cli\u003eHeat source area\u003c\/li\u003e\n\u003cli\u003eDie attach method\u003c\/li\u003e\n\u003cli\u003eSolder or bonding material\u003c\/li\u003e\n\u003cli\u003ePackage structure\u003c\/li\u003e\n\u003cli\u003eRequired thermal path\u003c\/li\u003e\n\u003cli\u003eElectrical isolation requirement\u003c\/li\u003e\n\u003cli\u003eBatch production requirement\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003eFor mature LED heat spreader applications, batch production can be discussed based on confirmed drawing, metallization stack and acceptance criteria.\u003c\/p\u003e\n\u003chr\u003e\n\u003ch2\u003eShape \u0026amp; Size Customization\u003c\/h2\u003e\n\u003cp\u003eMetallized CVD diamond heat spreaders are made according to customer drawings or specifications. Available shape options include:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eSquare heat spreaders\u003c\/li\u003e\n\u003cli\u003eRectangular heat spreaders\u003c\/li\u003e\n\u003cli\u003eRound components\u003c\/li\u003e\n\u003cli\u003eLED submount shapes\u003c\/li\u003e\n\u003cli\u003eChip-size heat spreaders\u003c\/li\u003e\n\u003cli\u003eMulti-chip heat spreaders\u003c\/li\u003e\n\u003cli\u003eCustom package-matched geometry\u003c\/li\u003e\n\u003cli\u003ePatterned metallization layouts\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003ePlease provide drawings, dimensions, thickness, metallization area and quantity for quotation.\u003c\/p\u003e\n\u003chr\u003e\n\u003ch2\u003eSurface Finish Options\u003c\/h2\u003e\n\u003cp\u003e\u003cstrong\u003eLapped Surface\u003c\/strong\u003e\u003cbr\u003eSuitable for standard thermal applications, further bonding preparation and cost-sensitive designs.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003ePolished Surface\u003c\/strong\u003e\u003cbr\u003eRecommended when improved surface contact, lower roughness or more controlled bonding conditions are required. Polished roughness is available up to Ra ≤ 30 nm, depending on size, thickness and material grade.\u003c\/p\u003e\n\u003cp\u003eSurface roughness, flatness and metallization adhesion requirements should be confirmed before production.\u003c\/p\u003e\n\u003chr\u003e\n\u003ch2\u003eProduct Features\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003eThermal grade polycrystalline CVD diamond base material\u003c\/li\u003e\n\u003cli\u003eHigh thermal conductivity diamond heat spreading layer\u003c\/li\u003e\n\u003cli\u003eElectrical insulation from the diamond substrate\u003c\/li\u003e\n\u003cli\u003eCustom copper, gold, silver or other metal coatings\u003c\/li\u003e\n\u003cli\u003eSingle-side or double-side metallization\u003c\/li\u003e\n\u003cli\u003eFull-area or patterned metallization available\u003c\/li\u003e\n\u003cli\u003eCustom shapes and sizes according to drawings\u003c\/li\u003e\n\u003cli\u003eSuitable for LED thermal management and die bonding applications\u003c\/li\u003e\n\u003cli\u003eLapped or polished surface options\u003c\/li\u003e\n\u003cli\u003ePolished surface roughness up to Ra ≤ 30 nm\u003c\/li\u003e\n\u003cli\u003eBatch production available after specification confirmation\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003chr\u003e\n\u003ch2\u003eRecommended Applications\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003eHigh-power LED heat spreaders\u003c\/li\u003e\n\u003cli\u003eLED chip submounts\u003c\/li\u003e\n\u003cli\u003eLED module thermal substrates\u003c\/li\u003e\n\u003cli\u003eLaser diode submounts\u003c\/li\u003e\n\u003cli\u003ePower electronics heat spreaders\u003c\/li\u003e\n\u003cli\u003eRF device thermal management\u003c\/li\u003e\n\u003cli\u003eSemiconductor package heat spreaders\u003c\/li\u003e\n\u003cli\u003eMulti-chip package thermal spreading\u003c\/li\u003e\n\u003cli\u003eCustom metallized diamond substrates\u003c\/li\u003e\n\u003cli\u003eResearch and prototype thermal packages\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cem\u003eFinal suitability depends on the customer's chip design, die attach process, metallization stack, bonding layer thickness and package thermal structure.\u003c\/em\u003e\u003c\/p\u003e\n\u003chr\u003e\n\u003ch2\u003eCustom RFQ Information\u003c\/h2\u003e\n\u003cp\u003eTo prepare a quotation for metallized CVD diamond heat spreaders, please provide the following information:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eApplication\u003c\/li\u003e\n\u003cli\u003eRequired diamond shape and dimensions\u003c\/li\u003e\n\u003cli\u003eThickness\u003c\/li\u003e\n\u003cli\u003eThermal conductivity grade\u003c\/li\u003e\n\u003cli\u003eSurface finish: lapped or polished\u003c\/li\u003e\n\u003cli\u003eMetallization material: Cu \/ Au \/ Ag \/ other\u003c\/li\u003e\n\u003cli\u003eMetallization stack, if specified\u003c\/li\u003e\n\u003cli\u003eSingle-side or double-side metallization\u003c\/li\u003e\n\u003cli\u003eFull-area or patterned metallization\u003cbr\u003e\n\u003c\/li\u003e\n\u003cli\u003eQuantity\u003c\/li\u003e\n\u003cli\u003eDrawing or package structure\u003cbr\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003chr\u003e\n\u003ch2\u003eImportant Notes\u003c\/h2\u003e\n\u003cp\u003eThis product is supplied as a custom metallized CVD diamond heat spreader or substrate. It is not supplied as a finished LED module, finished package or fully assembled electronic device unless otherwise agreed.\u003c\/p\u003e\n\u003cp\u003eThe metallization stack should be selected according to the customer's bonding process, solder material, die attach method, operating temperature and reliability requirements.\u003c\/p\u003e\n\u003cp\u003eThermal performance in the final application depends on the diamond material grade, component geometry, metallization structure, bonding layer thickness, thermal interface quality and overall package design.\u003c\/p\u003e\n\u003cp\u003eFor LED mass production applications, drawings, metallization stack, inspection criteria and acceptance requirements should be confirmed before batch production.\u003c\/p\u003e","brand":"Infi Advanced Materials","offers":[{"title":"Default Title","offer_id":45899326947385,"sku":null,"price":0.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0798\/2124\/2425\/files\/METAL1.jpg?v=1780458516","url":"https:\/\/diamondcomponent.com\/fr\/products\/custom-metallized-cvd-diamond-heat-spreaders","provider":"INFI diamond components","version":"1.0","type":"link"}