{"title":"DIAMOND COMPONENTS FOR THERMAL MANAGEMENT","description":"\u003ch3\u003eThermal-grade CVD diamond heat spreaders, metallized diamond substrates and custom diamond components for high-power LEDs, laser diodes, RF devices, power electronics and semiconductor packaging.\u003c\/h3\u003e","products":[{"product_id":"flexible-ultra-thin-cvd-diamond-film-on-adhesive-carrier-tape","title":"Flexible Ultra-Thin CVD Diamond Film on Adhesive Carrier Tape","description":"\u003ch1\u003eUltra-Thin CVD Diamond Film on Carrier Tape\u003c\/h1\u003e\n\u003cp\u003eUltra-thin polycrystalline CVD diamond film supplied on adhesive carrier tape for research, transfer processes, thermal material evaluation and microfabrication development.\u003c\/p\u003e\n\u003cp\u003eThe material is available in 2-inch and 4-inch wafer formats with typical film thicknesses between 8 μm and 15 μm. Depending on film quality and measurement method, thermal conductivity is typically estimated in the range of 800–1000 W\/m·K.\u003c\/p\u003e\n\u003cp\u003eThe carrier tape provides temporary mechanical support during handling, transport and process development.\u003c\/p\u003e\n\u003ch2\u003eSpecifications\u003c\/h2\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eItem\u003c\/th\u003e\n\u003cth\u003eDescription\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eMaterial\u003c\/td\u003e\n\u003ctd\u003ePolycrystalline CVD Diamond Film\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFormat\u003c\/td\u003e\n\u003ctd\u003e2-inch or 4-inch Wafer\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCarrier\u003c\/td\u003e\n\u003ctd\u003eAdhesive Carrier Tape\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eFilm Thickness\u003c\/td\u003e\n\u003ctd\u003eTypically 8–15 μm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eThermal Conductivity\u003c\/td\u003e\n\u003ctd\u003eApprox. 800–1000 W\/m·K\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSurface Finish\u003c\/td\u003e\n\u003ctd\u003eAs-Grown\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSurface Roughness\u003c\/td\u003e\n\u003ctd\u003eNot Specified\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCutting Service\u003c\/td\u003e\n\u003ctd\u003eNot Available in Current Format\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSupply Mode\u003c\/td\u003e\n\u003ctd\u003eRFQ or Stock Confirmation\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch2\u003eWhy Use Ultra-Thin Diamond Film?\u003c\/h2\u003e\n\u003cp\u003eDiamond combines high thermal conductivity, chemical stability and mechanical durability. When produced as an ultra-thin film, it becomes attractive for applications involving material transfer, thin-film integration, thermal spreading studies and advanced microfabrication processes.\u003c\/p\u003e\n\u003cp\u003eThe carrier-supported format allows handling of very thin diamond films that would otherwise be difficult to transport or process.\u003c\/p\u003e\n\u003ch2\u003eTypical Applications\u003c\/h2\u003e\n\u003cp\u003eUltra-thin CVD diamond films are commonly used in:\u003c\/p\u003e\n\u003cp\u003eDiamond membrane research\u003c\/p\u003e\n\u003cp\u003eThin-film transfer processes\u003c\/p\u003e\n\u003cp\u003eThermal material evaluation\u003c\/p\u003e\n\u003cp\u003eMicrofabrication process development\u003c\/p\u003e\n\u003cp\u003eHeat spreading studies\u003c\/p\u003e\n\u003cp\u003eSurface bonding experiments\u003c\/p\u003e\n\u003cp\u003eAdvanced substrate research\u003c\/p\u003e\n\u003cp\u003ePrototype device development\u003c\/p\u003e\n\u003ch2\u003eMaterial Characteristics\u003c\/h2\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eProperty\u003c\/th\u003e\n\u003cth\u003eTypical Value\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eFilm Thickness\u003c\/td\u003e\n\u003ctd\u003e8–15 μm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eThermal Conductivity\u003c\/td\u003e\n\u003ctd\u003e800–1000 W\/m·K\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eStructure\u003c\/td\u003e\n\u003ctd\u003ePolycrystalline Diamond\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSupport Format\u003c\/td\u003e\n\u003ctd\u003eCarrier Tape Mounted\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003cp\u003eThe term \"flexible diamond film\" refers to the carrier-supported thin-film format. The diamond layer itself remains a rigid ceramic material and should not be considered elastomeric or stretchable.\u003c\/p\u003e\n\u003ch2\u003eHandling Considerations\u003c\/h2\u003e\n\u003cp\u003eThe carrier tape is intended for transport and temporary support only. Process compatibility, temperature limits and transfer procedures should be evaluated by the user before production use.\u003c\/p\u003e\n\u003cp\u003eCare should be taken to avoid sharp folding, excessive bending or uncontrolled film removal. For transfer applications, a validated bonding and release process is recommended.\u003c\/p\u003e\n\u003ch2\u003eCustom Requirements\u003c\/h2\u003e\n\u003cp\u003ePlease discuss the following requirements before ordering:\u003c\/p\u003e\n\u003cp\u003eFilm thickness\u003c\/p\u003e\n\u003cp\u003eWafer format\u003c\/p\u003e\n\u003cp\u003eQuantity\u003c\/p\u003e\n\u003cp\u003eTransfer process requirements\u003c\/p\u003e\n\u003cp\u003eThermal performance requirements\u003c\/p\u003e\n\u003cp\u003eSurface characterization requirements\u003c\/p\u003e\n\u003cp\u003eSpecial inspection requests\u003c\/p\u003e\n\u003ch2\u003eOrdering Information\u003c\/h2\u003e\n\u003cp\u003eBecause process requirements vary significantly between applications, this material is supplied by RFQ.\u003c\/p\u003e\n\u003cp\u003eWhen requesting a quotation, please provide wafer size, quantity, intended application and any transfer, bonding or thermal performance requirements.\u003c\/p\u003e\n\u003cp\u003eStock photographs, visual inspection records and thickness information can be supplied upon request.\u003c\/p\u003e","brand":"Infi Advanced Materials","offers":[{"title":"2 inches","offer_id":45899021025337,"sku":null,"price":80.0,"currency_code":"USD","in_stock":true},{"title":"4 inches","offer_id":45899021058105,"sku":null,"price":200.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0798\/2124\/2425\/files\/film2_6665d726-88b3-4e0f-8cf8-74f0403c538f.jpg?v=1780458526"},{"product_id":"free-standing-thermal-grade-polycrystalline-cvd-diamond-heat-spreaders","title":"Free-Standing Thermal Grade Polycrystalline CVD Diamond Heat Spreaders","description":"\u003ch1\u003ePolycrystalline CVD Diamond Heat Spreader Plates\u003c\/h1\u003e\n\u003cp\u003eFree-standing polycrystalline CVD diamond heat spreader plates grown by microwave plasma CVD for thermal management and electronic packaging applications.\u003c\/p\u003e\n\u003cp\u003eThe material is available in thermal conductivity grades of 1000 W\/m·K, 1500+ W\/m·K and 1800+ W\/m·K. Parent plates are produced in 2-inch and 4-inch formats and can be cut into custom dimensions for heat spreaders, submounts, thermal substrates and prototype components.\u003c\/p\u003e\n\u003cp\u003eThicknesses from 0.05 mm to 2.0 mm are available, with lapped or polished surface finishes depending on application requirements.\u003c\/p\u003e\n\u003ch2\u003eSpecifications\u003c\/h2\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eItem\u003c\/th\u003e\n\u003cth\u003eDescription\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eMaterial\u003c\/td\u003e\n\u003ctd\u003ePolycrystalline CVD Diamond\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eGrowth Method\u003c\/td\u003e\n\u003ctd\u003eMicrowave Plasma CVD\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eStructure\u003c\/td\u003e\n\u003ctd\u003eFree-Standing Diamond Plate\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eParent Plate Size\u003c\/td\u003e\n\u003ctd\u003e2-inch, 4-inch\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eThickness Range\u003c\/td\u003e\n\u003ctd\u003e0.05–2.0 mm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eThermal Conductivity\u003c\/td\u003e\n\u003ctd\u003e1000, 1500+, 1800+ W\/m·K\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSurface Finish\u003c\/td\u003e\n\u003ctd\u003eLapped or Polished\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSurface Roughness\u003c\/td\u003e\n\u003ctd\u003eUp to Ra ≤ 30 nm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eShape\u003c\/td\u003e\n\u003ctd\u003eSquare, Rectangular, Round or Custom\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSupply Mode\u003c\/td\u003e\n\u003ctd\u003eCustom Manufacturing\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch2\u003eThermal Conductivity Grades\u003c\/h2\u003e\n\u003cp\u003e\u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0798\/2124\/2425\/files\/pcvd2.jpg?v=1780241423\" alt=\"\"\u003e\u003c\/p\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eGrade\u003c\/th\u003e\n\u003cth\u003eThermal Conductivity\u003c\/th\u003e\n\u003cth\u003eTypical Applications\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eStandard Thermal\u003c\/td\u003e\n\u003ctd\u003e1000 W\/m·K\u003c\/td\u003e\n\u003ctd\u003eGeneral Heat Spreading, Thermal Evaluation\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eHigh Thermal\u003c\/td\u003e\n\u003ctd\u003e1500+ W\/m·K\u003c\/td\u003e\n\u003ctd\u003eElectronic Packaging, RF Devices, Laser Modules\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePremium Thermal\u003c\/td\u003e\n\u003ctd\u003e1800+ W\/m·K\u003c\/td\u003e\n\u003ctd\u003eHigh-Power Electronics, Advanced Packaging, High Heat Flux Applications\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003cp\u003eMaterial appearance may vary from opaque to semi-transparent depending on grade and growth characteristics. For optical transmission applications, please refer to optical-grade CVD diamond products.\u003c\/p\u003e\n\u003ch2\u003eWhy Polycrystalline CVD Diamond?\u003c\/h2\u003e\n\u003cp\u003ePolycrystalline CVD diamond offers significantly higher thermal conductivity than conventional thermal management materials used in electronic packaging.\u003c\/p\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eMaterial\u003c\/th\u003e\n\u003cth\u003eTypical Thermal Conductivity (W\/m·K)\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eCopper\u003c\/td\u003e\n\u003ctd\u003e~400\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eAluminum Nitride (AlN)\u003c\/td\u003e\n\u003ctd\u003e170–220\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSilicon Carbide (SiC)\u003c\/td\u003e\n\u003ctd\u003e120–490\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePolycrystalline CVD Diamond\u003c\/td\u003e\n\u003ctd\u003e1000–1800+\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003cp\u003eThis combination of high thermal conductivity, electrical insulation and dimensional stability makes CVD diamond suitable for applications where localized heat must be spread efficiently.\u003c\/p\u003e\n\u003ch2\u003eTypical Applications\u003c\/h2\u003e\n\u003cp\u003ePolycrystalline CVD diamond heat spreaders are widely used in laser diode submounts, RF power devices, microwave electronics, power semiconductor modules, high-power LED systems and advanced semiconductor packaging.\u003c\/p\u003e\n\u003cp\u003eThe material is also used for thermal test vehicles, research projects and prototype thermal management assemblies.\u003c\/p\u003e\n\u003ch2\u003eCustom Cutting and Processing\u003c\/h2\u003e\n\u003cp\u003eFree-standing diamond plates can be supplied as full parent plates or precision-cut components.\u003c\/p\u003e\n\u003cp\u003eAvailable processing options include:\u003c\/p\u003e\n\u003cp\u003eCustom dimensions\u003c\/p\u003e\n\u003cp\u003eRound, square and irregular shapes\u003c\/p\u003e\n\u003cp\u003eThickness control\u003c\/p\u003e\n\u003cp\u003ePrecision polishing\u003c\/p\u003e\n\u003cp\u003eEdge processing\u003c\/p\u003e\n\u003cp\u003eInspection reports\u003c\/p\u003e\n\u003cp\u003eFor thin plates, tight-tolerance components or packaging applications, flatness, roughness and dimensional requirements should be specified during inquiry.\u003c\/p\u003e\n\u003ch2\u003eOrdering Information\u003c\/h2\u003e\n\u003cp\u003eFor quotation, please provide dimensions, thickness, thermal conductivity grade, quantity and surface finish requirements.\u003c\/p\u003e\n\u003cp\u003eDrawings, tolerance requirements and application information can help determine the most suitable material grade and manufacturing process.\u003c\/p\u003e","brand":"Infi Advanced Materials","offers":[{"title":"2 inch \/ 1000 W\/m.k","offer_id":45899271372857,"sku":null,"price":0.0,"currency_code":"USD","in_stock":true},{"title":"2 inch \/ 1500 W\/m.k","offer_id":45899271405625,"sku":null,"price":0.0,"currency_code":"USD","in_stock":true},{"title":"2 inch \/ 1800 W\/m.k","offer_id":45899271438393,"sku":null,"price":0.0,"currency_code":"USD","in_stock":true},{"title":"4 inch \/ 1000 W\/m.k","offer_id":45899271503929,"sku":null,"price":0.0,"currency_code":"USD","in_stock":true},{"title":"4 inch \/ 1500 W\/m.k","offer_id":45899271536697,"sku":null,"price":0.0,"currency_code":"USD","in_stock":true},{"title":"4 inch \/ 1800 W\/m.k","offer_id":45899271569465,"sku":null,"price":0.0,"currency_code":"USD","in_stock":true},{"title":"Custom size \/ 1000 W\/m.k","offer_id":45899271635001,"sku":null,"price":0.0,"currency_code":"USD","in_stock":true},{"title":"Custom size \/ 1500 W\/m.k","offer_id":45899271667769,"sku":null,"price":0.0,"currency_code":"USD","in_stock":true},{"title":"Custom size \/ 1800 W\/m.k","offer_id":45899271700537,"sku":null,"price":0.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0798\/2124\/2425\/files\/PCVD1.jpg?v=1780458519"},{"product_id":"custom-metallized-cvd-diamond-heat-spreaders","title":"Custom Metallized CVD Diamond Heat Spreaders","description":"\u003cp\u003eCustom metallized polycrystalline CVD diamond heat spreaders for high-power LED thermal management, die bonding and electronic packaging applications. Available with copper, gold, silver and other custom metal coatings, cut to customer-defined shapes and sizes.\u003c\/p\u003e\n\u003cp\u003eThese metallized polycrystalline CVD diamond heat spreaders are designed for high-performance thermal management applications, especially high-power LED packages, LED modules, laser diodes, power devices and custom electronic packaging.\u003c\/p\u003e\n\u003cp\u003eThe base material is thermal grade polycrystalline CVD diamond, offering high thermal conductivity, electrical insulation and excellent heat spreading capability. Metal coatings can be applied to one or both sides of the diamond surface to support die bonding, soldering, brazing, wire bonding or integration into customer-specific package structures.\u003c\/p\u003e\n\u003cp\u003eAvailable metallization options include copper, gold, silver and other custom metal stacks. Shape, size, thickness, metallization area and coating structure are customized according to customer drawings and assembly requirements.\u003c\/p\u003e\n\u003cp\u003e\u003cem\u003eThis product is supplied as a custom metallized diamond heat spreader, not as a finished LED module or finished electronic package.\u003c\/em\u003e\u003c\/p\u003e\n\u003chr\u003e\n\u003ch2\u003eProduct Specifications\u003c\/h2\u003e\n\u003ctable style=\"width: 100%; border-collapse: collapse;\" cellspacing=\"0\" border=\"0\"\u003e\n\u003cthead\u003e\n\u003ctr style=\"background-color: #f0f0f0;\"\u003e\n\u003cth style=\"padding: 8px 12px; text-align: left; width: 30%;\"\u003eItem\u003c\/th\u003e\n\u003cth style=\"padding: 8px 12px; text-align: left;\"\u003eSpecification\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003eProduct\u003c\/td\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003eMetallized Polycrystalline CVD Diamond Heat Spreader\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"background-color: #fafafa;\"\u003e\n\u003ctd style=\"padding: 8px 12px;\"\u003eBase Material\u003c\/td\u003e\n\u003ctd style=\"padding: 8px 12px;\"\u003eThermal grade polycrystalline CVD diamond\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003eGrowth Method\u003c\/td\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003eMicrowave plasma CVD\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"background-color: #fafafa;\"\u003e\n\u003ctd style=\"padding: 8px 12px;\"\u003eStructure\u003c\/td\u003e\n\u003ctd style=\"padding: 8px 12px;\"\u003eFree-standing CVD diamond plate with metallization\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003eApplication\u003c\/td\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003eLED thermal management, die bonding, electronic packaging\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"background-color: #fafafa;\"\u003e\n\u003ctd style=\"padding: 8px 12px;\"\u003eShape\u003c\/td\u003e\n\u003ctd style=\"padding: 8px 12px;\"\u003eCustom square, rectangular, round or special shape\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003eSize\u003c\/td\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003eCustom according to drawing\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"background-color: #fafafa;\"\u003e\n\u003ctd style=\"padding: 8px 12px;\"\u003eThickness\u003c\/td\u003e\n\u003ctd style=\"padding: 8px 12px;\"\u003eCustom, according to thermal and packaging requirement\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003eThermal Conductivity Grade\u003c\/td\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003e1000 W\/m·K \/ 1500+ W\/m·K \/ 1800+ W\/m·K\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"background-color: #fafafa;\"\u003e\n\u003ctd style=\"padding: 8px 12px;\"\u003eSurface Finish\u003c\/td\u003e\n\u003ctd style=\"padding: 8px 12px;\"\u003eLapped \/ Polished (Ra ≤ 30 nm)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003eMetallization Options\u003c\/td\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003eCu, Au, Ag and custom metal stacks\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"background-color: #fafafa;\"\u003e\n\u003ctd style=\"padding: 8px 12px;\"\u003eMetallization Side\u003c\/td\u003e\n\u003ctd style=\"padding: 8px 12px;\"\u003eSingle-side \/ Double-side \/ Patterned\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003eBonding Compatibility\u003c\/td\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003eSoldering, brazing, die attach or customer-defined process\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr style=\"background-color: #fafafa;\"\u003e\n\u003ctd style=\"padding: 8px 12px;\"\u003eOrder Type\u003c\/td\u003e\n\u003ctd style=\"padding: 8px 12px;\"\u003eCustom RFQ\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003eDocumentation\u003c\/td\u003e\n\u003ctd style=\"padding: 8px 12px; border-top: 1px solid #e0e0e0;\"\u003eDimensional inspection, surface information, metallization notes and actual photos available upon request\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003chr\u003e\n\u003ch2\u003eMetallization Options\u003c\/h2\u003e\n\u003cp\u003eMetal coatings can be applied to the CVD diamond surface according to the customer's bonding method, package structure and thermal interface requirement.\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eCopper metallization\u003c\/li\u003e\n\u003cli\u003eGold metallization\u003c\/li\u003e\n\u003cli\u003eSilver metallization\u003c\/li\u003e\n\u003cli\u003eNickel \/ Gold metallization\u003c\/li\u003e\n\u003cli\u003eTitanium \/ Platinum \/ Gold metallization\u003c\/li\u003e\n\u003cli\u003eChromium \/ Gold metallization\u003c\/li\u003e\n\u003cli\u003eCustom adhesion layer + functional metal layer\u003c\/li\u003e\n\u003cli\u003eSingle-side metallization\u003c\/li\u003e\n\u003cli\u003eDouble-side metallization\u003c\/li\u003e\n\u003cli\u003eFull-area or patterned metallization\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003eThe final metallization stack should be selected according to the customer's bonding process, solder material, operating temperature, adhesion requirement and package design. For LED thermal applications, please provide the die attach method and assembly process before quotation.\u003c\/p\u003e\n\u003chr\u003e\n\u003ch2\u003eBase Diamond Thermal Grades\u003c\/h2\u003e\n\u003cp\u003e\u003cstrong\u003e1000 W\/m·K Grade\u003c\/strong\u003e\u003cbr\u003eOpaque thermal grade CVD diamond for cost-sensitive thermal spreading applications.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003e1500+ W\/m·K Grade\u003c\/strong\u003e\u003cbr\u003eSemi-transparent higher thermal grade CVD diamond for higher-performance heat spreading applications.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003e1800+ W\/m·K Grade\u003c\/strong\u003e\u003cbr\u003eTransparent premium thermal grade CVD diamond for demanding thermal management and advanced packaging applications.\u003c\/p\u003e\n\u003cp\u003e\u003cem\u003eThe transparent appearance of higher thermal grades is used as a material grade description and should not be treated as an optical window specification.\u003c\/em\u003e\u003c\/p\u003e\n\u003chr\u003e\n\u003ch2\u003eLED Thermal Management Applications\u003c\/h2\u003e\n\u003cp\u003eMetallized CVD diamond heat spreaders are suitable for high-power LED packages and LED thermal modules where fast heat spreading, electrical insulation and compact package design are required.\u003c\/p\u003e\n\u003cp\u003eThe diamond heat spreader can be used as a thermal spreading layer between the LED chip and the package substrate, or as a customized submount component depending on the customer's design.\u003c\/p\u003e\n\u003cp\u003eFor LED applications, the metallized diamond component can be customized according to:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eLED chip size\u003c\/li\u003e\n\u003cli\u003eHeat source area\u003c\/li\u003e\n\u003cli\u003eDie attach method\u003c\/li\u003e\n\u003cli\u003eSolder or bonding material\u003c\/li\u003e\n\u003cli\u003ePackage structure\u003c\/li\u003e\n\u003cli\u003eRequired thermal path\u003c\/li\u003e\n\u003cli\u003eElectrical isolation requirement\u003c\/li\u003e\n\u003cli\u003eBatch production requirement\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003eFor mature LED heat spreader applications, batch production can be discussed based on confirmed drawing, metallization stack and acceptance criteria.\u003c\/p\u003e\n\u003chr\u003e\n\u003ch2\u003eShape \u0026amp; Size Customization\u003c\/h2\u003e\n\u003cp\u003eMetallized CVD diamond heat spreaders are made according to customer drawings or specifications. Available shape options include:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eSquare heat spreaders\u003c\/li\u003e\n\u003cli\u003eRectangular heat spreaders\u003c\/li\u003e\n\u003cli\u003eRound components\u003c\/li\u003e\n\u003cli\u003eLED submount shapes\u003c\/li\u003e\n\u003cli\u003eChip-size heat spreaders\u003c\/li\u003e\n\u003cli\u003eMulti-chip heat spreaders\u003c\/li\u003e\n\u003cli\u003eCustom package-matched geometry\u003c\/li\u003e\n\u003cli\u003ePatterned metallization layouts\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003ePlease provide drawings, dimensions, thickness, metallization area and quantity for quotation.\u003c\/p\u003e\n\u003chr\u003e\n\u003ch2\u003eSurface Finish Options\u003c\/h2\u003e\n\u003cp\u003e\u003cstrong\u003eLapped Surface\u003c\/strong\u003e\u003cbr\u003eSuitable for standard thermal applications, further bonding preparation and cost-sensitive designs.\u003c\/p\u003e\n\u003cp\u003e\u003cstrong\u003ePolished Surface\u003c\/strong\u003e\u003cbr\u003eRecommended when improved surface contact, lower roughness or more controlled bonding conditions are required. Polished roughness is available up to Ra ≤ 30 nm, depending on size, thickness and material grade.\u003c\/p\u003e\n\u003cp\u003eSurface roughness, flatness and metallization adhesion requirements should be confirmed before production.\u003c\/p\u003e\n\u003chr\u003e\n\u003ch2\u003eProduct Features\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003eThermal grade polycrystalline CVD diamond base material\u003c\/li\u003e\n\u003cli\u003eHigh thermal conductivity diamond heat spreading layer\u003c\/li\u003e\n\u003cli\u003eElectrical insulation from the diamond substrate\u003c\/li\u003e\n\u003cli\u003eCustom copper, gold, silver or other metal coatings\u003c\/li\u003e\n\u003cli\u003eSingle-side or double-side metallization\u003c\/li\u003e\n\u003cli\u003eFull-area or patterned metallization available\u003c\/li\u003e\n\u003cli\u003eCustom shapes and sizes according to drawings\u003c\/li\u003e\n\u003cli\u003eSuitable for LED thermal management and die bonding applications\u003c\/li\u003e\n\u003cli\u003eLapped or polished surface options\u003c\/li\u003e\n\u003cli\u003ePolished surface roughness up to Ra ≤ 30 nm\u003c\/li\u003e\n\u003cli\u003eBatch production available after specification confirmation\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003chr\u003e\n\u003ch2\u003eRecommended Applications\u003c\/h2\u003e\n\u003cul\u003e\n\u003cli\u003eHigh-power LED heat spreaders\u003c\/li\u003e\n\u003cli\u003eLED chip submounts\u003c\/li\u003e\n\u003cli\u003eLED module thermal substrates\u003c\/li\u003e\n\u003cli\u003eLaser diode submounts\u003c\/li\u003e\n\u003cli\u003ePower electronics heat spreaders\u003c\/li\u003e\n\u003cli\u003eRF device thermal management\u003c\/li\u003e\n\u003cli\u003eSemiconductor package heat spreaders\u003c\/li\u003e\n\u003cli\u003eMulti-chip package thermal spreading\u003c\/li\u003e\n\u003cli\u003eCustom metallized diamond substrates\u003c\/li\u003e\n\u003cli\u003eResearch and prototype thermal packages\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cem\u003eFinal suitability depends on the customer's chip design, die attach process, metallization stack, bonding layer thickness and package thermal structure.\u003c\/em\u003e\u003c\/p\u003e\n\u003chr\u003e\n\u003ch2\u003eCustom RFQ Information\u003c\/h2\u003e\n\u003cp\u003eTo prepare a quotation for metallized CVD diamond heat spreaders, please provide the following information:\u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003eApplication\u003c\/li\u003e\n\u003cli\u003eRequired diamond shape and dimensions\u003c\/li\u003e\n\u003cli\u003eThickness\u003c\/li\u003e\n\u003cli\u003eThermal conductivity grade\u003c\/li\u003e\n\u003cli\u003eSurface finish: lapped or polished\u003c\/li\u003e\n\u003cli\u003eMetallization material: Cu \/ Au \/ Ag \/ other\u003c\/li\u003e\n\u003cli\u003eMetallization stack, if specified\u003c\/li\u003e\n\u003cli\u003eSingle-side or double-side metallization\u003c\/li\u003e\n\u003cli\u003eFull-area or patterned metallization\u003cbr\u003e\n\u003c\/li\u003e\n\u003cli\u003eQuantity\u003c\/li\u003e\n\u003cli\u003eDrawing or package structure\u003cbr\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003chr\u003e\n\u003ch2\u003eImportant Notes\u003c\/h2\u003e\n\u003cp\u003eThis product is supplied as a custom metallized CVD diamond heat spreader or substrate. It is not supplied as a finished LED module, finished package or fully assembled electronic device unless otherwise agreed.\u003c\/p\u003e\n\u003cp\u003eThe metallization stack should be selected according to the customer's bonding process, solder material, die attach method, operating temperature and reliability requirements.\u003c\/p\u003e\n\u003cp\u003eThermal performance in the final application depends on the diamond material grade, component geometry, metallization structure, bonding layer thickness, thermal interface quality and overall package design.\u003c\/p\u003e\n\u003cp\u003eFor LED mass production applications, drawings, metallization stack, inspection criteria and acceptance requirements should be confirmed before batch production.\u003c\/p\u003e","brand":"Infi Advanced Materials","offers":[{"title":"Default Title","offer_id":45899326947385,"sku":null,"price":0.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0798\/2124\/2425\/files\/METAL1.jpg?v=1780458516"},{"product_id":"single-crystal-cvd-diamond-heat-spreader-1800-2200-w-m-k","title":"Single Crystal CVD Diamond Heat Spreader, 1800–2200 W\/m·K","description":"\u003ch1\u003eSingle Crystal CVD Diamond Heat Spreaders\u003c\/h1\u003e\n\u003cp\u003eSingle crystal CVD diamond heat spreaders for high-power electronic, photonic and semiconductor applications.\u003c\/p\u003e\n\u003cp\u003eWith thermal conductivity typically ranging from 1800 to 2200 W\/m·K, single crystal CVD diamond is widely used where conventional thermal management materials cannot provide sufficient heat spreading performance. The combination of ultra-high thermal conductivity and electrical insulation makes it suitable for RF devices, laser diodes, GaN electronics, SiC power modules and advanced semiconductor packaging.\u003c\/p\u003e\n\u003cp\u003eStandard sizes from 3 × 3 mm to 20 × 20 mm are available. Custom dimensions, thicknesses, surface finishes and metallization options can be manufactured according to application requirements.\u003c\/p\u003e\n\u003ch2\u003eSpecifications\u003c\/h2\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eItem\u003c\/th\u003e\n\u003cth\u003eDescription\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eMaterial\u003c\/td\u003e\n\u003ctd\u003eSingle Crystal CVD Diamond\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eThermal Conductivity\u003c\/td\u003e\n\u003ctd\u003e1800–2200 W\/m·K\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eStandard Sizes\u003c\/td\u003e\n\u003ctd\u003e3 × 3 mm to 20 × 20 mm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eShape\u003c\/td\u003e\n\u003ctd\u003eSquare, Rectangular or Custom\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eThickness\u003c\/td\u003e\n\u003ctd\u003eCustom\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSurface Finish\u003c\/td\u003e\n\u003ctd\u003eLapped, Polished or Custom\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMetallization\u003c\/td\u003e\n\u003ctd\u003eAvailable Upon Request\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eElectrical Property\u003c\/td\u003e\n\u003ctd\u003eElectrically Insulating\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSupply Mode\u003c\/td\u003e\n\u003ctd\u003eStandard Sizes or Custom Manufacturing\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch2\u003eWhy Use Single Crystal CVD Diamond?\u003c\/h2\u003e\n\u003cp\u003eHeat generated by modern RF devices, laser diodes and power semiconductors is often concentrated within a very small active area. Single crystal CVD diamond offers thermal conductivity significantly higher than copper, aluminum nitride and most conventional substrate materials, helping reduce junction temperature and improve thermal reliability.\u003c\/p\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eMaterial\u003c\/th\u003e\n\u003cth\u003eTypical Thermal Conductivity (W\/m·K)\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eCopper\u003c\/td\u003e\n\u003ctd\u003e~400\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eAluminum Nitride (AlN)\u003c\/td\u003e\n\u003ctd\u003e170–220\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003ePolycrystalline CVD Diamond\u003c\/td\u003e\n\u003ctd\u003e1200–2000\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSingle Crystal CVD Diamond\u003c\/td\u003e\n\u003ctd\u003e1800–2200\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003cp\u003eFor compact devices with high power density, diamond heat spreaders are frequently used as thermal substrates, submounts or heat-spreading layers positioned directly beneath the heat source.\u003c\/p\u003e\n\u003ch2\u003eTypical Applications\u003c\/h2\u003e\n\u003cp\u003eSingle crystal CVD diamond heat spreaders are commonly used in:\u003c\/p\u003e\n\u003cp\u003eRF power amplifiers and microwave devices\u003c\/p\u003e\n\u003cp\u003eGaN RF components\u003c\/p\u003e\n\u003cp\u003eSiC power electronics\u003c\/p\u003e\n\u003cp\u003eLaser diode submounts\u003c\/p\u003e\n\u003cp\u003eHigh-power laser modules\u003c\/p\u003e\n\u003cp\u003eOptoelectronic devices\u003c\/p\u003e\n\u003cp\u003eAdvanced semiconductor packaging\u003c\/p\u003e\n\u003cp\u003eResearch and prototype thermal platforms\u003c\/p\u003e\n\u003ch2\u003eCustom Manufacturing\u003c\/h2\u003e\n\u003cp\u003eCustom fabrication services are available for dimensions, thickness, polishing quality and metallization requirements.\u003c\/p\u003e\n\u003cp\u003eDepending on the application, the diamond component may be supplied as a bare heat spreader, metallized thermal substrate or precision-finished submount ready for further assembly.\u003c\/p\u003e\n\u003cp\u003eInspection reports, dimensional measurements and product photographs can be provided before shipment.\u003c\/p\u003e\n\u003ch2\u003eOrdering Information\u003c\/h2\u003e\n\u003cp\u003eFor quotation, please provide dimensions, thickness, surface finish requirements, metallization requirements and quantity.\u003c\/p\u003e\n\u003cp\u003eFor RF, laser or semiconductor applications, information such as mounting method, operating power level and package structure can help optimize material selection and manufacturing specifications.\u003c\/p\u003e","brand":"Infi Advanced Materials","offers":[{"title":"Default Title","offer_id":45900461473849,"sku":null,"price":0.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0798\/2124\/2425\/files\/Single_crystal_CVD_diamond_heat_spreader_for_thermal_management2.jpg?v=1780458515"},{"product_id":"single-crystal-cvd-diamond-microchannel-heat-sink-with-metallization","title":"Single Crystal CVD Diamond Microchannel Heat Sink with Metallization","description":"\u003ch1\u003eSingle Crystal CVD Diamond Microchannel Heat Sink\u003c\/h1\u003e\n\u003cp\u003eSingle crystal CVD diamond microchannel heat sinks for liquid-cooled thermal management of high-power semiconductor and photonic devices.\u003c\/p\u003e\n\u003cp\u003eThe combination of diamond heat spreading and microchannel convection enables efficient heat removal close to the active junction, making this structure suitable for applications where conventional heat spreaders are insufficient.\u003c\/p\u003e\n\u003cp\u003eCustom microchannel geometries, metallization designs and mounting surfaces are available according to thermal and packaging requirements.\u003c\/p\u003e\n\u003ch2\u003eSpecifications\u003c\/h2\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eItem\u003c\/th\u003e\n\u003cth\u003eDescription\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eMaterial\u003c\/td\u003e\n\u003ctd\u003eSingle Crystal CVD Diamond\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eStructure\u003c\/td\u003e\n\u003ctd\u003eDiamond Substrate with Microchannels\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCooling Method\u003c\/td\u003e\n\u003ctd\u003eLiquid Cooling\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSurface Option\u003c\/td\u003e\n\u003ctd\u003eBare Diamond or Metallized Surface\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eShape\u003c\/td\u003e\n\u003ctd\u003eSquare, Rectangular or Custom\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eThickness\u003c\/td\u003e\n\u003ctd\u003eCustom\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eChannel Design\u003c\/td\u003e\n\u003ctd\u003eCustom Width, Depth, Pitch and Flow Path\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eSurface Finish\u003c\/td\u003e\n\u003ctd\u003eLapped, Polished or Custom\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eIntegration\u003c\/td\u003e\n\u003ctd\u003eDie Attach, Submount, Thermal Substrate\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch2\u003eTypical Applications\u003c\/h2\u003e\n\u003cp\u003eSingle crystal diamond microchannel heat sinks are used in thermal management systems where heat is generated within a small active area and must be removed efficiently.\u003c\/p\u003e\n\u003cp\u003eCommon applications include GaN RF amplifiers, microwave devices, SiC power modules, laser diode assemblies, photonic components and advanced semiconductor packages.\u003c\/p\u003e\n\u003ch2\u003eMetallization Options\u003c\/h2\u003e\n\u003cp\u003eMetallized surfaces can be supplied for die attachment, soldering, wire bonding and package integration.\u003c\/p\u003e\n\u003cp\u003eMetal stack design is selected according to the assembly process and application requirements.\u003c\/p\u003e\n\u003ch2\u003eCustom Manufacturing\u003c\/h2\u003e\n\u003cp\u003eThe following parameters can be customized:\u003c\/p\u003e\n\u003cp\u003eChannel geometry\u003c\/p\u003e\n\u003cp\u003eChannel depth and pitch\u003c\/p\u003e\n\u003cp\u003eFlow path design\u003c\/p\u003e\n\u003cp\u003eSubstrate dimensions\u003c\/p\u003e\n\u003cp\u003eDiamond thickness\u003c\/p\u003e\n\u003cp\u003eSurface finish\u003c\/p\u003e\n\u003cp\u003eMetallization structure\u003c\/p\u003e\n\u003cp\u003eInlet and outlet configuration\u003c\/p\u003e\n\u003cp\u003eEngineering review based on customer drawings is available.\u003c\/p\u003e\n\u003ch2\u003eFlat Diamond vs Microchannel Diamond\u003c\/h2\u003e\n\u003ctable\u003e\n\u003cthead\u003e\n\u003ctr\u003e\n\u003cth\u003eStructure\u003c\/th\u003e\n\u003cth\u003eTypical Function\u003c\/th\u003e\n\u003c\/tr\u003e\n\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eFlat Diamond Heat Spreader\u003c\/td\u003e\n\u003ctd\u003ePassive heat spreading\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMetallized Diamond Heat Spreader\u003c\/td\u003e\n\u003ctd\u003eHeat spreading with device mounting\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDiamond Microchannel Heat Sink\u003c\/td\u003e\n\u003ctd\u003eLiquid-cooled thermal management\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eMetallized Diamond Microchannel\u003c\/td\u003e\n\u003ctd\u003eCooling and package integration\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch2\u003eOrdering Information\u003c\/h2\u003e\n\u003cp\u003eMicrochannel heat sinks are manufactured according to customer requirements.\u003c\/p\u003e\n\u003cp\u003eFor quotation, please provide substrate dimensions, channel design, coolant type, mounting method and target quantity. Thermal simulations, drawings and packaging information may be included if available.\u003c\/p\u003e","brand":"Infi Advanced Materials","offers":[{"title":"Default Title","offer_id":45900588286009,"sku":null,"price":0.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0798\/2124\/2425\/files\/CVD_diamond_microchannel_cooler_for_high_heat_flux_thermal_management.jpg?v=1780458515"}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0798\/2124\/2425\/collections\/pcvd4.jpg?v=1780579669","url":"https:\/\/diamondcomponent.com\/fr\/collections\/diamond-components-for-thermal-management.oembed","provider":"INFI diamond components","version":"1.0","type":"link"}